- Footprint / dimensions: 2,150 × 1,700 × 1,500 mm (+ 500 mm signal tower)
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Maximum board size: 380 × 500 mm (optionally up to 550 × 950 mm)
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Minimum board size: 30 × 30 mm
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Board thickness: 0.5 mm to 4.5 mm
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Smallest PCB footprint: 30 × 30 mm
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Component top height: up to 16 mm
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Placement accuracy: ± 50 µm (with 1 µm encoders)
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Placement throughput: 9,000 CPH typical (12,000 CPH IPC-9850 rated)
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Feeder capacity : up to 180 feeders
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Tape feeder widths supported: 8 to 44 mm
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Supported component types: SMD chip, MELF, SOT, SOIC, TSOP, PLCC, QFP, BGA, LCC, µBGA
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Smallest pitch supported: 0.3 mm (with second alignment camera)
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Power: 220 VAC, 50–60 Hz, ~2,500 W
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Compressed air: 6 bar, ~80 L/min
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Operating temperature: 18–30 °C
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Noise: < 70 dB(A)
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Weight: ~700 kg (without feeders), ~950 kg (with feeders)
